HFM, a global brand of heat transfer and fluid handling supply platform.

Liquid Cooling | For Data Center

Liquid Cooling for Data Centers

High-Density Cooling Solutions for Modern Compute Loads

As data centers evolve toward AI, HPC, and GPU-intensive workloads, traditional air cooling can no longer remove the rising heat density.

Liquid cooling delivers efficient, reliable thermal management, and HFM provides the engineered heat-exchange solutions that make it possible. Our plate heat exchangers integrate into CDUs, cold plates, and immersion systems to support next-generation data center cooling.

CDU-Based Liquid Cooling Systems

The Core of Chip-Level Thermal Management

A Coolant Distribution Unit (CDU) is the central module in most liquid cooling architectures. It stabilizes coolant temperature, controls flow rate, manages pressure, and transfers heat to the facility loop through a high-performance plate heat exchanger.

CDU

Cold Plate Cooling

Direct Chip-Level Heat Removal

Cold plates attach directly to CPU/GPU chip surfaces. Heat is absorbed and carried away by circulating coolant.

Single-Phase Cold Plate Cooling

Coolant remains liquid throughout the loop
Simple, stable, and widely adopted
Ideal for AI servers, GPU blades, and high-density racks

Two-Phase Cold Plate Cooling

Coolant evaporates at the chip surface for higher heat capture
Supports extremely high heat flux
Recommended for large GPU clusters and advanced AI accelerators

Immersion Cooling Solutions

Single-Phase & Two-Phase Immersion for Extreme Densities

Immersion cooling submerges IT hardware in dielectric fluid, eliminating air cooling limitations and significantly improving thermal performance.

Single-Phase Immersion

Equipment fully submerged in dielectric liquid
Heat removed by pumped circulation
Best for stable, energy-saving data center designs

Two-Phase Immersion

Dielectric liquid vaporizes on hot components
Exceptional cooling capacity
Suitable for hyperscale AI and HPC workloads

Why HFM Liquid Cooling Solutions

Engineering-Driven Performance for Mission-Critical Operations

HFM delivers liquid-cooling-ready heat-exchange solutions optimized for data center conditions:

Customized plate heat exchangers for CDUs and facility loops
Low-temperature-difference operation for improved PUE
Precise thermal sizing matched to server load
Materials engineered for coolant compatibility
Support for modular, scalable cooling architectures
Integration guidance for OEMs, module suppliers, and facility engineers

Applications in Modern Data Centers

HFM liquid cooling solutions support:

AI training clusters and LLM computing centers
GPU-dense hyperscale data centers
High-Performance Computing (HPC)
Edge data centers and micro-modules
Financial computing and scientific simulation workloads

We ensure stable cooling performance for mission-critical operations.

Data Center Cooling

Gasketed plate heat exchanger